Press Releases

Press Releases

Find the latest Dymax press releases to learn about global and local company initiatives.

Showing 162 results

FIP/CIP Gasket Helps Eliminate Failures Caused by Adhesion Loss

Resistant to High-Temperature and High-Moisture Environments.

April 11, 2013

LED-Optimized Medical Electronics Coating Offers Operating Cost Savings

Use of LEDs results in higher electrical efficiency and instant on/off capability.

April 04, 2013

New Optical Display Adhesives Maintain Optical Clarity

Non-yellowing formula provides better performance and aesthetics.

April 25, 2013

SpeedMask® 734-BT Versatile, Peelable Masking Resin Simplifies Masking Processes

Dymax Corporation’s SpeedMask® 734-BT UV/Visible light-curable masking resin is formulated to provide good surface protection during grit blast, plating, acid etch, and stripping operations.

March 01, 2013

Dual-Cure Conformal Coating Eliminates Need for Additional Processing

Dymax Corporation has introduced Dual-Cure 9482, a light- and moisture-cure conformal coating specially formulated to cure in shadowed areas underneath components on printed circuit boards.  

February 25, 2013

Light-Curable Needle-Bonding Adhesive Eliminates Need for Secondary Processing

Dymax Corporation’s MD® 1193-M-SV05, a new, multipurpose medical-device adhesive, cures tack-free quickly upon exposure to UV and/or visible light, eliminating the need for heat or secondary moisture cure on high-speed assembly lines. 

February 26, 2013

New Adhesive Resists High Temperature and Moisture

Dymax Corporation has introduced Ultra Light-Weld® 431, a versatile adhesive for glass-to-glass and glass-to-metal applications.

February 20, 2013

Fast-Curing LCP Adhesive Provides Instant Bonds on Speaker Substrates

Dymax Corporation’s Ultra Light-Weld® 9671 is a UV/Visible light-curable adhesive designed for bonding LCP (liquid crystal polymer) on microspeaker housings.  

January 04, 2012

SpeedMask® 726-SC Versatile, Peelable Masking Resin Simplifies Masking Processes

Easy application and removal facilitates increased throughput.

April 19, 2012
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