Comunicados de prensa

Comunicados de prensa

Find the latest Dymax press releases to learn about global and local company initiatives.

Se muestran 161 resultados

Recubrimiento par componentes electrónicos médicos optimizado para LED ofrece ahorros en costo operativo

Use of LEDs results in higher electrical efficiency and instant on/off capability.

April 04, 2013

Nuevos adhesivos para pantallas ópticas mantienen la claridad óptica

Non-yellowing formula provides better performance and aesthetics.

April 25, 2013

La versátil resina de enmascarado removible SpeedMask® 734-BT simplifica los procesos de enmascarado

Dymax Corporation’s SpeedMask® 734-BT UV/Visible light-curable masking resin is formulated to provide good surface protection during grit blast, plating, acid etch, and stripping operations.

01 de marzo de 2013

El recubrimiento electrónico Dual-Cure elimina la necesidad de procesamiento adicional

Dymax Corporation has introduced Dual-Cure 9482, a light- and moisture-cure conformal coating specially formulated to cure in shadowed areas underneath components on printed circuit boards.  

February 25, 2013

Adhesivo para pegado de agujas curable con luz elimina la necesidad de un procesamiento secundario

Dymax Corporation’s MD® 1193-M-SV05, a new, multipurpose medical-device adhesive, cures tack-free quickly upon exposure to UV and/or visible light, eliminating the need for heat or secondary moisture cure on high-speed assembly lines. 

February 26, 2013

Nuevo adhesivo resiste alta temperatura y humedad

Dymax Corporation has introduced Ultra Light-Weld® 431, a versatile adhesive for glass-to-glass and glass-to-metal applications.

February 20, 2013

Adhesivo para LCP de curado rápido pega al instante sustratos de bocinas

Dymax Corporation’s Ultra Light-Weld® 9671 is a UV/Visible light-curable adhesive designed for bonding LCP (liquid crystal polymer) on microspeaker housings.  

January 04, 2012

La versátil resina de enmascarado removible SpeedMask® 726-SC simplifica los procesos de enmascarado

Easy application and removal facilitates increased throughput.

April 19, 2012

La resina para empaques FIP ofrece ventajas significativas sobre los materiales tradicionales para empaques

In-line curing allows for increased production speed, lower processing costs, and reduced inventories.

08 de marzo de 2012
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