Electronics across optical and telecommunications industries require specialized adhesives that deliver precise alignment, long-term clarity, and structural protection. Dymax light-curable materials support manufacturers building optoelectronic devices, optical modules, and telecom infrastructure by improving process speed, assembly accuracy, and environmental resistance.
Application solutions include:
Optoelectronics Assembly – Light-curable adhesives formulated to deliver low-shrink, low-stress bonds for high-precision alignment and secure fixturing of lenses, sensors, VCSELs, and other photonic components.
Telecom Electronics Assembly – Light-curable materials for bonding, encapsulating, and coating optical modules and PCBs to ensure signal integrity, mechanical reliability, and environmental durability in telecom electronics.
