Light-Cure BGA, CSP Reinforcement Adhesive

Dymax 9310 cures upon exposure to light and is designed for rapid ruggedization of circuit board components.  This adhesive is specially formulated to cure with heat in applications where shadowed areas exist.  Ideal applications for this material include reinforcement of fine-pitch or leadless components on printed circuit boards, shock absorption, and underfill alternative.  This material provides rapid bonding to PVC, SAN, and glass.

Dymax materials contain no nonreactive solvents.  Their ability to cure in seconds enables faster processing, greater output, and lower processing costs.  When cured with Dymax light-curing  spot lamps, focused beam lamps, flood lamps, or conveyor systems, they deliver optimum speed and performance.  Dymax lamps offer the ideal balance of UV and visible light for the fastest, deepest cures.

This product is in full compliance with the RoHS Directives 2015/863/EU.