Soluciones de alto rendimiento para estaciones de carga de EV

A Faster, "Greener" Assembly Process and Increased Efficiency & Throughput

Dymax 9483 conformal coating cures tack free with UV/Visible light first, and then with ambient moisture in 2-3 days, excelling in PCB applications where shadow areas are present. This re-workable coating is well suited for high-value boards and exhibits outstanding temperature, chemical, and corrosion resistance, as well as excellent thermal shock and high-temperature flexibility. It can be applied from 2 mils (0.002") to 7 mils (0.007") thick on rigid PCBs and flexible circuits, has no flash off, and fluoresces blue for quality inspection.

9-20351-F high-viscosity coating/encapsulant is engineered for application thicknesses between 2 mils (0.002") to 20 mils (0.020") making it ideal for potting and sealing inside wire harnesses. Its excellent moisture barrier properties and secondary heat-cure capability provide a solution for shadow areas on densely populated PCBs. Blue fluorescing makes the material easy to see, speeding the
up post-cure inspection process.

Multi-Cure® 9037-F encapsulant features excellent moisture and thermal resistance and is a good choice for use as a corrosion guard for wire-bond connections. Formulated with blue fluorescing technology, the material is highly visible on encapsulated PCB modules when exposed to low-intensity black light and is suited for simple visual or automated inspection systems. It also has a secondary heat cure for shadow areas. 9-20351-F and 9037-F both pass -40 to 150°C thermal shock and 85°C/95% R.H. testing.

Since all products are one-component, have no solvents added, and are environmentally friendly, there are no special requirements for disposal making for an overall "greener" process. By using Dymax light-curable materials, the company realized faster throughput due to rapid light cure, no pot life for less waste, no mixing, and cure on demand for less rework. The manufacturer was able to increase efficiency and save costs by reducing the overall processing time and scrap rate.