Material encapsulante y adhesivo para el pegado de alambres estable a temperatura ambiente
Introducing the newest product in the Dymax encapsulant family, dual-cure 9014, which is formulated to cure with UV light and then secondary moisture cure for shadow areas on printed circuit boards.
Dymax Corporation, a leading manufacturer of rapid curing materials and equipment, introduces the newest product in its encapsulant family, dual-cure 9014, which is formulated to cure with UV light and then secondary moisture cure for shadow areas on printed circuit boards.
Curing in seconds upon exposure to UV light energy, 9014 increases manufacturing efficiency because assembled parts can be moved quickly to the next step in production. This new formulation is also room-temperature stable, eliminating the need for cold-shipping and storage.
Para fabricantes dedicados al ensamblaje de chip a tarjeta, chip a vidrio y pegado de alambres, este material exhibe una excelente flexibilidad y mayor durabilidad y resistencia en tarjetas. El 9014 también ofrece una buena protección contra la humedad y corrosión para componentes críticos en aplicaciones electrónicas como sistemas de gestión de batería de vehículos eléctricos. Recommended surfaces include Kapton, glass, and FR4.
If you are interested in seeing a demonstration of this product, Dymax will be exhibiting at The Battery Show 2019 in Novi, MI, at the Suburban Collection Showcase, booth 2245, September 10-12th. Technical experts will be on hand to answer all your questions.